首页> 外国专利> The ki - array which corresponds to JIS standard on the surface was printed (on the following ki - array print aspect, stuck those which print the form of each manipulation ki - individually in another material, to individual corresponding place) at plus circuit laying film, insulating film, 0 circuit laying film and the structure which consists of IC infrastructure, waterproof bini - ru etc it was overturned extensively, (ramine - to it did), waterproof dustproof ki - bo - do for the personal computer.

The ki - array which corresponds to JIS standard on the surface was printed (on the following ki - array print aspect, stuck those which print the form of each manipulation ki - individually in another material, to individual corresponding place) at plus circuit laying film, insulating film, 0 circuit laying film and the structure which consists of IC infrastructure, waterproof bini - ru etc it was overturned extensively, (ramine - to it did), waterproof dustproof ki - bo - do for the personal computer.

机译:在正电路铺设膜上印刷与表面上符合JIS标准的ki阵列(在下面的ki阵列打印方面,将分别印刷每种操作ki的形式的ki-分别粘贴在另一种材料中,粘贴到单独的相应位置)。 ,绝缘膜,0电路敷设膜以及由IC基础设施组成的结构,防水bini-ru等被大幅度推翻了(用于拉米机),防水防尘ki-bo-用于个人计算机。

摘要

Topic Like former ki - bo - do, the liquid from with the ki - part and the computer and ki - bo - do which the erroneous operation etc with the invasion of the dust does not make cause, has waterproof dustproof performance is offered.SolutionsManipulation ki - of former ki - bo - do, the rally body for ki - restoration, computer deflection - mu, the computer deflection - mu sabot, it removed, the manipulation ki - array print which corresponds to JIS standard on the surface it made (on the above-mentioned ki - array print aspect, those which print the form of each manipulation ki - individually in another material, were stuck to individual corresponding place), the plus circuit laying film, the insulating film and 0 circuit laying film containment springiness, IC infrastructure in order the electric information by electrification controls to the konpiyu - ta - computer to send,The structure which consists of at waterproof bini - ru and the like it was overturned extensively, (ramine - to it did) ki - bo - do. Choice figure Drawing 1
机译:像以前的ki-bo-do一样,不会由于灰尘的侵入而引起误操作等引起的与ki-部分和计算机和ki-bo-do一样的液体,具有防水防尘性能解决方案以前的ki-bo-do的操作ki-恢复ki的拉力体,计算机的挠度-mu,计算机的挠度-mu sabot,将其删除,其表面上符合JIS标准的操作ki-阵列打印。制作(在上述的ki-阵列印刷方面,将在另一种材料上分别印刷每个操作ki-的形式的印刷物粘贴在单独的相应位置上),正电路铺设膜,绝缘膜和0电路铺设膜密封性,IC基础设施通过电气控制将电气信息发送给konpiyu-ta-计算机发送,由防水bini-ru等构成的结构被广泛翻转,(拉米-选择它)ki-bo-do。<选择图形>绘制1

著录项

  • 公开/公告号JP3115717U

    专利类型

  • 公开/公告日2005-11-17

    原文格式PDF

  • 申请/专利权人 小林 健一;

    申请/专利号JP20050003914U

  • 发明设计人 小林 健一;

    申请日2005-04-28

  • 分类号G06F3/02;H01H13/04;H01H13/70;

  • 国家 JP

  • 入库时间 2022-08-21 21:49:28

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