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Copper alloy and its production mannered null mass for lead/read

机译:铜合金及其生产方式中铅/铅的零质量

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive copper alloy for lead frame, excellent in mechanical strength, electric conductivity, heat resistance, and direct bonding property and suitable for lead frame material, and its production. ;SOLUTION: This copper alloy for lead frame has a composition consisting of, by weight, 0.5-5% Fe, 0.01-0.2% P, and the balance essentially Cu with inevitable impurities. Further, 0.05-0.5%, in total, of one or ≥2 elements selected from Sn, Zn, and Pb are incorporated into this composition. The copper alloy for lead frame can be produced by applying hot working to the above copper alloy and then performing, before cold working, two-stage aging treatment consisting of high temp. aging treatment at ≥550°C for ≥0.1 min and low temp. aging treatment at ≤520°C for ≥1 min.;COPYRIGHT: (C)1998,JPO
机译:要解决的问题:提供一种廉价的用于引线框架的铜合金,其机械强度,导电性,耐热性和直接粘合性能优异,并且适合于引线框架材料及其生产。 ;解决方案:这种用于引线框架的铜合金的成分为0.5-5%(重量)的Fe,0.01-0.2%(重量)的P,其余部分基本上为Cu,带有不可避免的杂质。此外,总共0.05-0.5%的选自Sn,Zn和Pb的一种或约2种元素被掺入该组合物中。引线框架用铜合金可以通过对上述铜合金进行热加工,然后在冷加工之前进行由高温组成的两阶段时效处理来制造。在550℃下进行0.1分钟和低温的时效处理。 520°C时效处理1分钟;版权:(C)1998,JPO

著录项

  • 公开/公告号JP3772319B2

    专利类型

  • 公开/公告日2006-05-10

    原文格式PDF

  • 申请/专利权人 同和鉱業株式会社;

    申请/专利号JP19970177529

  • 发明设计人 神崎 敏裕;董 樹新;

    申请日1997-05-29

  • 分类号C22C9/00;H01L21/50;H01L23/48;H01L23/50;

  • 国家 JP

  • 入库时间 2022-08-21 21:49:24

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