Impregnation point to the epoxy resin constituent to the production mannered null backing material

摘要

PROBLEM TO BE SOLVED: To provide a prepreg which improves reliability on interlayer connection to a printed wiring board when it is manufactured by processing a hole for interlayer connection thereto and filling the hole with a conductive paste, followed by molding thereof.;SOLUTION: The prepreg 1 is obtained by impregnating an epoxy resin composition into a substrate followed by heat drying, bringing the epoxy resin composition into a stage B. The epoxy resin composition at the stage B is specific in having a resin softening temperature in the range of 55-75°C.;COPYRIGHT: (C)2004,JPO