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Method of improving via filling uniformity in isolated and dense via-pattern regions
Method of improving via filling uniformity in isolated and dense via-pattern regions
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机译:改善隔离和密集通孔图案区域中通孔填充均匀性的方法
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摘要
An isotropic-diffusion filling method uses a thermal process on a result structure comprising a photoresist layer and an organic material layer to create a cross-linking layer there between, which minimizes step height differences between isolated and dense via-pattern regions for optimizing a subsequent trench process and simplifying process steps.
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