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Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape

机译:载带,具有该载带的电子设备的制造方法以及具有该载带的带载包装体

摘要

A carrier tape, configured for use in an electronic device assembly process, includes a base film having a long edge and a plurality of first holes which extend through the base film. The first holes are aligned in a line that is adjacent to and parallel to the long edge of the base film and are spaced at a regular pitch. The carrier tape further includes a plurality of second holes which extend through the base film and which are aligned in the line. The second holes are spaced at the regular pitch and are respectively located between adjacent pairs of the first holes. Also, there is provided a method of manufacturing an electronic device with the carrier tape and a tape carrier package with the carrier tape.
机译:一种配置用于电子设备组装过程的载带,包括具有长边缘的基膜和延伸穿过该基膜的多个第一孔。第一孔以与基膜的长边相邻并平行的线对齐,并且以规则的间距隔开。载带还包括多个第二孔,这些第二孔延伸穿过基膜并且在直线上对准。第二孔以规则的间距间隔开并且分别位于相邻的一对第一孔之间。此外,提供了一种制造具有载带的电子设备的方法以及具有载带的带载包装的制造方法。

著录项

  • 公开/公告号US2005252828A1

    专利类型

  • 公开/公告日2005-11-17

    原文格式PDF

  • 申请/专利权人 YOSHIKAZU TAKAHASHI;

    申请/专利号US20050073766

  • 发明设计人 YOSHIKAZU TAKAHASHI;

    申请日2005-03-08

  • 分类号B65D85/30;

  • 国家 US

  • 入库时间 2022-08-21 21:46:00

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