首页>
外国专利>
Method for CuO reduction by using two step nitrogen oxygen and reducing plasma treatment
Method for CuO reduction by using two step nitrogen oxygen and reducing plasma treatment
展开▼
机译:两步氮氧还原等离子体处理还原CuO的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for cleaning a copper interconnect after a chemical-mechanical polishing that comprises: a) treating the surface of said copper interconnect with a nitrogen and oxygen containing treatment; and b) without breaking vacuum, treating the copper interconnect with a NH3 or H2 plasma treatment. Next a cap layer is formed over the copper interconnect.
展开▼