首页> 外国专利> Increasing the copper to superconductor ratio of a superconductor wire by cladding with copper-based strip

Increasing the copper to superconductor ratio of a superconductor wire by cladding with copper-based strip

机译:通过覆铜基带材增加超导线的铜与超导体比

摘要

A method for increasing the copper to superconductor ratio of a superconductor core wire by forming a copper-based strip about the core wire which at least partially encloses the core wire in contact therewith by deforming the strip longitudinally into a U shape nested about the wire; and soldering the wire and strip in the assembly of step (a) to form a strong mechanical, electrical and thermal bond therebetween.
机译:一种通过在芯线上形成铜基带而增加超导体芯线的铜与超导体之比的方法,该基带通过将带沿纵向变形为嵌套在导线周围的U形而至少部分地包围与其接触的芯线;在步骤(a)的组件中焊接导线和带材,以在它们之间形成牢固的机械,电气和热结合。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号