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Model for modifying drill data to predict hole locations in a panel structure

机译:用于修改钻探数据以预测面板结构中孔位置的模型

摘要

A method of creating a mathematical model which is employed in the determination of at least one work location in a multi-layered laminated circuit panel. The mathematical model for modifying drill data takes into consideration translational and rotational compensations caused by the encountered stretching or shrinking of the multi-layered panel subsequent to pressing or due to thermally processing, whereby the mathematical model may be utilized to modify drill data in order to accurately predict hole or via locations.
机译:一种创建数学模型的方法,该方法用于确定多层层压电路板中的至少一个工作位置。用于修改钻探数据的数学模型考虑了由于在压制之后或由于热处理而导致的多层板的拉伸或收缩而引起的平移和旋转补偿,由此可以利用该数学模型来修改钻探数据,以便准确预测孔或通过位置。

著录项

  • 公开/公告号US2006253270A1

    专利类型

  • 公开/公告日2006-11-09

    原文格式PDF

  • 申请/专利权人 MANH-QUAN TAM NGUYEN;

    申请/专利号US20060431356

  • 发明设计人 MANH-QUAN TAM NGUYEN;

    申请日2006-05-10

  • 分类号G06F17/10;

  • 国家 US

  • 入库时间 2022-08-21 21:44:15

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