首页>
外国专利>
Enhanced step coverage of thin films on patterned substrates by oblique angle PVD
Enhanced step coverage of thin films on patterned substrates by oblique angle PVD
展开▼
机译:斜角PVD增强了图案化基板上薄膜的阶梯覆盖
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method and an apparatus for fabricating an integrated circuit entail directing a vapor flux toward a substrate surface from a plurality of directions associated with a plurality of azimuth angles, and selecting a deposition angle of the vapor flux, relative to a normal incidence, to obtain a substantially conformal film. The surface feature can be associated with, for example, one or more vias and/or one or more trenches.
展开▼