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Method of manufacturing mask for electron beam lithography and mask blank for electron beam lithography

机译:电子束光刻用掩模的制造方法及电子束光刻用掩模坯料

摘要

This invention provides a method of manufacturing mask for electron beam lithography and a mask blank for electron beam lithography, which could prevent damage upon a front side of an SOI (Silicon On Insulator) layer and also provide desirable etching of a silicon base layer of an SOI substrate is used.;A mask blank for electron beam lithography is manufactured as an intermediary product by etching a silicon base layer and a BOX layer subsequent to forming a protective layer on a front side of an SOI (Silicon On Insulator) layer simultaneously with forming a hard mask on a back side of the SOI layer. Then, an etching process is performed upon the SOI layer to thereby complete a manufacture process of a mask for electron beam lithography having an aperture for transmitting an electron beam therethrough.
机译:本发明提供了一种制造用于电子束光刻的掩模和用于电子束光刻的掩模坯料的方法,其可以防止对SOI(绝缘体上硅)层的前侧的损坏,并且还提供期望的蚀刻硅的硅基层的方法。 ;通过在与SOI(绝缘体上硅)层的正面同时形成保护层之后,蚀刻硅基层和BOX层,制造出用于电子束光刻的掩模坯料,作为中间产品。在SOI层的背面上形成硬掩模。然后,在SOI层上执行蚀刻工艺,从而完成用于电子束光刻的掩模的制造工艺,该掩模具有用于使电子束透射通过的开口。

著录项

  • 公开/公告号US7029801B2

    专利类型

  • 公开/公告日2006-04-18

    原文格式PDF

  • 申请/专利权人 MITSUHIRO YUASA;

    申请/专利号US20020303847

  • 发明设计人 MITSUHIRO YUASA;

    申请日2002-11-26

  • 分类号G03F9/00;G03C5/00;

  • 国家 US

  • 入库时间 2022-08-21 21:43:49

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