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Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set

机译:毫米波(MMW)收发器模块,带有发射器,接收器和本地振荡器倍频器表面安装芯片组

摘要

A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC chip package, and a local oscillator (LO) multiplier MMIC chip package. Each MMIC chip package includes a base and a multilayer substrate board formed from layers of low temperature transfer tape. The multilayer substrate board has at least three layers and carries RF signals, DC signals, grounding and embedded passive components, including resistors and capacitors. At least one MMIC chip is received on the multilayer substrate board.
机译:毫米波(MMW)收发器模块包括表面安装在电路板上的微波单片集成电路(MMIC)收发器芯片组。 MMIC收发器芯片组包括接收器MMIC芯片封装,发送器MMIC芯片封装和本地振荡器(LO)乘法器MMIC芯片封装。每个MMIC芯片封装都包括一个基底和一个多层基板,该多层基板由低温转印带层形成。多层基板至少有三层,并承载RF信号,DC信号,接地和嵌入式无源元件,包括电阻器和电容器。至少一个MMIC芯片容纳在多层基板上。

著录项

  • 公开/公告号US6998708B2

    专利类型

  • 公开/公告日2006-02-14

    原文格式PDF

  • 申请/专利权人 DANNY F. AMMAR;

    申请/专利号US20030647674

  • 发明设计人 DANNY F. AMMAR;

    申请日2003-08-25

  • 分类号H01L23/34;

  • 国家 US

  • 入库时间 2022-08-21 21:43:26

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