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Alignment apparatus, control method therefor, exposure apparatus, device manufacturing method, semiconductor manufacturing factory, and exposure apparatus maintenance method
Alignment apparatus, control method therefor, exposure apparatus, device manufacturing method, semiconductor manufacturing factory, and exposure apparatus maintenance method
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机译:对准设备,其控制方法,曝光设备,器件制造方法,半导体制造工厂和曝光设备维护方法
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摘要
An alignment apparatus including a first position measuring device and a second position measuring device which measure position information of an object to be controlled, a switching device which switches a position measuring system from the first position measuring device to the second position measuring device, depending on a moving area of the object to be controlled, a correction computing device which performs a correction calculation for a measurement result from the first position measuring device using a first correction parameter set to obtain a current position of the object to be controlled, a predicted coordinate computing unit which predicts coordinates of the object to be controlled on the basis of progress of a correction calculation result from the correction computing device, and a reverse correction computing device which performs a calculation for the coordinates predicted by the predicted coordinate computing unit using a second correction parameter set to obtain a command value for the second position measuring device.
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