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Micro-electromechanical fluid ejection device that incorporates a shape memory alloy based actuator

机译:包含基于形状记忆合金的执行器的微机电流体喷射装置

摘要

A micro-electromechanical fluid ejection device includes a wafer substrate. Drive circuitry is positioned on the wafer substrate. A nozzle chamber structure is arranged on the wafer substrate to define a nozzle chamber and a fluid ejection port in fluid communication with the nozzle chamber. A fluid ejection member is operatively positioned with respect to the nozzle chamber such that displacement of the fluid ejection member results in the ejection of fluid from the fluid ejection port. At least a portion of the fluid ejection member is of a shape memory alloy which defines an electrical heating circuit and which is connected to the drive circuitry to be heated by an electrical current received from the drive circuitry, the shape memory alloy being displaceable towards the fluid ejection port when heated to transform from its martensitic phase to its austenitic phase to eject fluid from the fluid ejection port.
机译:微机电流体喷射装置包括晶片基板。驱动电路位于晶片衬底上。喷嘴室结构布置在晶片衬底上,以限定喷嘴室和与喷嘴室流体连通的流体喷射口。流体喷射构件相对于喷嘴室可操作地定位,使得流体喷射构件的位移导致流体从流体喷射口的喷射。流体喷射构件的至少一部分由形状记忆合金制成,该形状记忆合金限定了电加热电路,并且该形状记忆合金连接至驱动电路,以通过从驱动电路接收的电流来加热,该形状记忆合金可朝着驱动电路移动。当流体排出口被加热以从其马氏体相转变成其奥氏体相以从流体排出口喷射流体时,该流体排出口被加热。

著录项

  • 公开/公告号US7086720B2

    专利类型

  • 公开/公告日2006-08-08

    原文格式PDF

  • 申请/专利权人 KIA SILVERBROOK;

    申请/专利号US20040982789

  • 发明设计人 KIA SILVERBROOK;

    申请日2004-11-08

  • 分类号B41J2/04;B41J2/05;

  • 国家 US

  • 入库时间 2022-08-21 21:42:14

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