首页> 外国专利> High density semiconductor memory cell and memory array using a single transistor and having counter-doped poly and buried diffusion wordline

High density semiconductor memory cell and memory array using a single transistor and having counter-doped poly and buried diffusion wordline

机译:使用单个晶体管并具有反向掺杂的多晶硅和掩埋扩散字线的高密度半导体存储单元和存储阵列

摘要

A programmable memory cell comprised of a transistor located at the crosspoint of a column bitline and a row wordline is disclosed. The transistor has its gate formed from the column bitline and its source connected to the row wordline. The memory cell is programmed by applying a voltage potential between the column bitline and the row wordline to produce a programmed p+ region to form a p-n diode in the substrate underlying the gate of the transistor. Further, the wordline is formed from a buried diffusion N+ layer while the column bitline is formed from a counterdoped polysilicon layer.
机译:公开了一种由位于列位线和行字线的交点处的晶体管组成的可编程存储单元。该晶体管的栅极由列位线形成,其源极连接至行字线。通过在列位线和行字线之间施加电压电势来编程存储单元,以产生编程的p +区域,从而在晶体管栅极下方的衬底中形成p-n二极管。此外,字线由掩埋扩散N +层形成,而列位线由反掺杂多晶硅层形成。

著录项

  • 公开/公告号US6992925B2

    专利类型

  • 公开/公告日2006-01-31

    原文格式PDF

  • 申请/专利权人 JACK ZEZHONG PENG;

    申请/专利号US20040798753

  • 发明设计人 JACK ZEZHONG PENG;

    申请日2004-03-10

  • 分类号G11C11/34;

  • 国家 US

  • 入库时间 2022-08-21 21:41:11

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