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Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
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机译:紧凑型封装设计,用于垂直腔表面发射激光器阵列到光纤电缆的连接
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摘要
A housing for opto-electronic array devices. The housing includes a base and walls that form a region that receives an opto-electronic semiconductor array. Conductive traces are disposed on a wall such that a front part of the traces are exposed for external electrical connections, while the back part is exposed for internal electrical connections. A transparent substrate having a plurality of micro-lenses cover the base, walls and opto-electronic semiconductor array device. Each micro lens is beneficially made from optical epoxy that is deposited by an ink-jet nozzle. The base and walls are beneficially comprised of a ceramic.
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