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The product of transmissivity with higher, low infrared emissivity
The product of transmissivity with higher, low infrared emissivity
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机译:透射率高,红外辐射率低的乘积
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摘要
Using the process for including board mold molding as a metal plate (A110), with slot (A111), mold cores (A113), a periphery (A115) and bolt hole (A116).
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