METHOD FOR MANUFACTURING CONDUCTIVE WAFERS, METHOD FOR MANUFACTURING THIN-PLATE SINTERED COMPACTS, METHOD FOR MANUFACTURING CERAMIC SUBSTRATES FOR THIN-FILM MAGNETIC HEAD, AND METHOD FOR MACHINING CONDUCTIVE WAFERS

摘要

A METHOD FOR MANUFACTURING THIN-PLATE SINTERED COMPACTS ACCORDING TO THE PRESENT INVENTION INCLUDES THE STEPS OF: FORMING A CONDUCTIVE SINTERED COMPACT (10) TO HAVE SUCH A THICKNESS AS TO CAUSE A WARP TO A NEGLIGIBLE DEGREE; AND SLICING THE CONDUCTIVE SINTERED COMPACT (10), THEREBY CUTTING AND DIVIDING THE CONDUCTIVE SINTERED COMPACT INTO AT LEAST TWO WAFERS (10A, 10B). FIGURE 1