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METHOD OF TOP COATING A COVERING PROFILE AND LEVELLING PROFILE FOR FLOORING
METHOD OF TOP COATING A COVERING PROFILE AND LEVELLING PROFILE FOR FLOORING
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机译:地坪覆盖面和水平剖面的顶部涂覆方法
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摘要
The invention relates to a method for coating a cover profile (1) and at leastone compensation profile (5) of a cover device, which can be connected to acover flange (3) of the cover profile (1) and which is used for floor coveringprovided with a cover layer (7). Said cover layer (7) is stuck to a preprofile(8) prior to the cover profile (1) being produced from the preprofile (8)which is coated by the cover layer (7). According to the invention, theadvantages of said production is that the cover profile (1) and thecompensation profile (5) which is connected to the lower side of the coverflange (3) of the cover profile (1) by at least one web (9), forms thepreprofile (8), such that external surfaces of the preprofile (8), which formthe visible sides of the cover profile (1) and the compensation profile (5),are covered with protruding strips (13) of the cover layer (7) over thelongitudinal edge (10) of the visible sides (a) and that the path (9) passesbetween the cover profile (1) and the compensation profile (5) after bendingthe protruding strip areas (12) of the cover layer (7) about the longitudinaledge (10) of the visible sides (a).
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