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COMPOSITE BONDING MATERIAL OF BERYLLIUM, COPPER ALLOY AND STAINLESS STEEL AND COMPOSITE BONDING METHOD

机译:铍铜合金和不锈钢的复合结合材料及复合结合方法

摘要

PROBLEM TO BE SOLVED: To effectively join three of beryllium, copper alloy and stainless steel, without the sensitization problem of stainless steel, by using stainless steel as the base material and laminating copper alloy first and then beryllium on top of it, through one diffusion welding process. ;SOLUTION: An X-ray transmission window is joined with a stainless steel 3 as a structure and with a copper alloy 2 as a heat sink material. As a method of simultaneously joining the three, i.e., stainless steel 3, copper alloy 2 and beryllium 1, what is called glass coating HIP is adapted advantageously. in which the entire joining body is covered with glass powder 4 and then heated/ pressurized. In this case, between the beryllium 1 and the copper alloy 2, an insert material is interposed such as niobium which brings solid phase minimum temperature 870° or above for each alloy system, with the three simultaneously joined by one diffusion welding process under the conditions in which temperature is not less than 850°C but less than solidus line minimum temperature and in which pressure is 20-300MPa.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:以不锈钢为基础材料,先将铜合金层压然后在其顶部层压铍,然后通过一次扩散,以有效地结合铍,铜合金和不锈钢中的三种,而不会出现不锈钢的敏化问题。焊接过程。 ;解决方案:X射线透射窗与作为结构的不锈钢3和作为散热器材料的铜合金2连接在一起。作为同时接合不锈钢3,铜合金2和铍1这三种的方法,有利地采用了所谓的玻璃涂层HIP。其中整个接合体被玻璃粉末4覆盖,然后被加热/加压。在这种情况下,在铍1和铜合金2之间插入诸如铌的插入材料,其使固相最低温度为870℃。对于每种合金系统,均应在温度不低于850℃但低于固相线最低温度且压力为20-300 MPa的条件下通过扩散焊接工艺同时连接三种合金。 C)1998,日本特许厅

著录项

  • 公开/公告号EP0901869B1

    专利类型

  • 公开/公告日2006-04-26

    原文格式PDF

  • 申请/专利权人 NGK INSULATORS LTD;

    申请/专利号EP19980901089

  • 发明设计人 IWADACHI TAKAHARU;

    申请日1998-02-02

  • 分类号B23K20/00;G21K5/00;B23K20/02;H01J35/18;

  • 国家 EP

  • 入库时间 2022-08-21 21:32:09

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