首页> 外国专利> Method for preparing an electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same

Method for preparing an electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same

机译:制备用于通孔的导电浆料的方法以及使用该浆料制备单片陶瓷基板的方法

摘要

As an electrically conductive paste for via-holes, an organic vehicle and an electrically conductive metal powder 1 coated with an insoluble resin 2 which is insoluble in the organic vehicle are prepared. Filling via-holes with the electrically conductive paste for via-holes produces a monolithic ceramic. Filling characteristics of the electrically conductive paste into via-holes are improved, and cracks and elevations of the conductive metal and cracks of the ceramic barely form during the baking step. Further, the resulting monolithic ceramic substrate can maintain excellent soldering wettability and plating characteristics. IMAGE
机译:作为通孔用导电糊剂,准备有机载体和涂布有不溶于该有机载体的不溶性树脂2的导电性金属粉末1。用用于通孔的导电膏填充通孔产生单片陶瓷。改善了导电浆料到通孔中的填充特性,并且在烘烤步骤中几乎不形成导电金属的裂纹和隆起以及陶瓷的裂纹。此外,所得到的整体陶瓷基板可以保持优异的焊接润湿性和镀敷特性。 <图像>

著录项

  • 公开/公告号EP0905775B1

    专利类型

  • 公开/公告日2006-07-12

    原文格式PDF

  • 申请/专利权人 MURATA MANUFACTURING CO;

    申请/专利号EP19980117910

  • 发明设计人 OHSHITA KAZUHITO;TANI HIROJI;

    申请日1998-09-22

  • 分类号H01L23/498;

  • 国家 EP

  • 入库时间 2022-08-21 21:32:11

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