首页>
外国专利>
Method for preparing an electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same
Method for preparing an electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same
展开▼
机译:制备用于通孔的导电浆料的方法以及使用该浆料制备单片陶瓷基板的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
As an electrically conductive paste for via-holes, an organic vehicle and an electrically conductive metal powder 1 coated with an insoluble resin 2 which is insoluble in the organic vehicle are prepared. Filling via-holes with the electrically conductive paste for via-holes produces a monolithic ceramic. Filling characteristics of the electrically conductive paste into via-holes are improved, and cracks and elevations of the conductive metal and cracks of the ceramic barely form during the baking step. Further, the resulting monolithic ceramic substrate can maintain excellent soldering wettability and plating characteristics. IMAGE
展开▼