首页>
外国专利>
Method of manufacturing beryllium-copper alloy hot isostatic press (Hip) bonded body and hip-bonded body
Method of manufacturing beryllium-copper alloy hot isostatic press (Hip) bonded body and hip-bonded body
展开▼
机译:铍铜合金热等静压键合体和髋键合体的制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A HIP-bonded body of a beryllium member and copper alloy member. Before subjecting the members to HIP processing, a diffusion inhibiting layer is deposited on the outer surface of the copper alloy member. A bond promoting layer of aluminum or aluminum alloy is then formed on the diffusion inhibiting layer. During the HIP bonding step, an insert composed of an aluminum-magnesium or aluminum-silicon-magnesium alloy is juxtaposed between the outer aluminum layer of the pre-treated copper alloy member and the beryllium member. IMAGE
展开▼