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Addition of copper salts and copper complexes to thermal inkjet inks for kogation reduction
Addition of copper salts and copper complexes to thermal inkjet inks for kogation reduction
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机译:在热喷墨油墨中添加铜盐和铜络合物以减少结垢
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摘要
Copper salts and copper organic complexes are added to thermal inkjet inks, to deliver copper to a resistor surface where the copper ion aids in removal of koga.
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