HOLED ELECTROLYTIC METALLIC FOIL, HOLED ELECTROLYTIC METALLIC FOIL WITH CARRIER BASE MATERIAL, AND METHOD OF MANUFACTURING THE SAME

摘要

Holed electrolytic metallic foils enabling, according to purposes, the designing of those parameters such as the size, shape, position, and depth of micro through holes and the quality of the micro through holes per unit area. The holed electrolytic metallic foil (1) is characterized by comprising the plurality of micro through holes (7) passed, when one surface side of the holed electrolytic metallic foil is taken as a reference plane, to other surface side so as to be positioned roughly vertical to the reference plane. The holed electrolytic metallic foil with a carrier base material is characterized in that the carrier base material and the holed electrolytic metallic foil are laminated on each other to improve the handling capability of the holed electrolytic metallic foil with the plurality of micro through holes in the thickness direction. A method of manufacturing these metallic foils is characterized in that an insulating projected part is formed on the surface of the carrier base material and metal plating is applied to the surface of the carrier base material on which the insulating projected part is formed to form the holed electrolytic metallic foil on the surface of the carrier base material.