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HIGHLY FILLED COMPOSITES OF POWDERED FILLERS AND POLYMER MATRIX

机译:填充料和聚合物基料的高填充复合材料

摘要

Highly filled composite materials, e.g. comprising approximately 60 volume % or greater of finely powdered particles of filler in a polymer matrix, are made by dissolving polymer in a volatilisable solvent, adding filler and forming a homogeneous mixture by high shear mixing. Most solvent is then removed while maintaining homogeneity in the mixture, preferably by evaporation in a high shear mill. Then, extruding a thin layer of the composite material and removing remaining solvent, as by heating. Bodies are formed from the dried layer, which are heated and pressed to melt and disperse melted polymer into the interstices between filler particles. Thereby, certain polymers unusable at low solids contents become effective bonding materials at high solids contents. Filler materials are chosen to tailor electrical and physical properties of the articles, which may comprise substrates for electronic circuits. Suitable polymers are certain polyarylene ethers soluble in cyclohexanone.
机译:高度填充的复合材料,例如通过将聚合物溶解在挥发性溶剂中,添加填料并通过高剪切混合形成均匀的混合物来制备包含约60体积%或更大的聚合物基质中的填料的细粉颗粒的混合物。然后除去大部分溶剂,同时保持混合物的均质性,优选在高剪切磨机中蒸发。然后,挤出复合材料的薄层并通过加热除去残留的溶剂。由干燥层形成主体,将其干燥并加热并使其熔融,然后将熔融的聚合物分散到填料颗粒之间的空隙中。因此,某些在低固含量下不能使用的聚合物成为高固含量下的有效粘结材料。选择填充材料以调整制品的电气和物理性能,所述制品可以包括用于电子电路的基底。合适的聚合物是某些可溶于环己酮的聚亚芳基醚。

著录项

  • 公开/公告号EP1446251A4

    专利类型

  • 公开/公告日2006-03-22

    原文格式PDF

  • 申请/专利权人 KREIDO LABORATORIES;

    申请/专利号EP20020768924

  • 申请日2002-10-01

  • 分类号B22F3/12;C08J3/20;B01F13/10;B22F1;B22F3/20;B22F3/22;B22F7/02;B22F7/04;B29B7/40;B29B7/90;B29C47;B29C48/38;B29C67/24;B29C70/58;B32B15/08;C08J5;C08K3;C08K7/24;C08L71;C08L71/12;C08L101;C22C32;H01L21/60;H01L23/14;H01L23/29;H01L23/31;H05K1/03;H05K3/02;

  • 国家 EP

  • 入库时间 2022-08-21 21:30:20

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