METHOD FOR MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD WITH ELECTRONIC COMPONENT MOUNTED THEREON, AND ELECTRONIC EQUIPMENT WITH SAID CIRCUIT BOARD MOUNTED THEREON

摘要

A heat curable adhesive (13) is coated onto a circuit board (20) in its position where an electronic component (14) is mounted. Solder (22) is printed on a land (21) on which another electronic component is mounted, and the electronic component is mounted. The circuit board (20) and the electronic component (14) are brought into contact or electrically connected to each other by thermocompression bonding. When the heat curable adhesive (13) is in an initial state or a semi-cured state in which a cured state exists, another electronic component is mounted, followed by reflow to conduct electrical connection between the electronic component (14) and the other electronic component and the circuit board (20) through solder bonding, and to cure the heat curable adhesive (13).