首页> 外国专利> PLASTIC HOUSING AND SEMI-CONDUCTOR COMPONENT COMPRISING SAID TYPE OF PLASTIC HOUSING IN ADDITION TO A METHOD FOR THE PRODUCTION THEREOF

PLASTIC HOUSING AND SEMI-CONDUCTOR COMPONENT COMPRISING SAID TYPE OF PLASTIC HOUSING IN ADDITION TO A METHOD FOR THE PRODUCTION THEREOF

机译:包括塑料外壳的所述类型的塑料外壳和半导体组件,以及其制造方法

摘要

The invention relates to a plastic housing (1) and to a semi-conductor component (2) comprising said type of plastic housing (1), in addition to a method for the production thereof. Said plastic housing (1) has plastic external surfaces (3) which comprise external contact surfaces (5), consisting of external contacts, which are arranged on the lower side thereof (4). The plastic external surfaces (3) are covered with a continuous metal layer (7) until the lower side (4), whereby the defining layer (8) comprises electrically conductive deposits (9) of the plastic (10) of the housing (10) which are arranged between the plastic outer surfaces (3) and the continuous metal layer (7).
机译:本发明涉及一种塑料外壳(1)以及一种包括所述类型的塑料外壳(1)的半导体部件(2),此外还涉及一种制造方法。所述塑料外壳(1)具有塑料外表面(3),该塑料外表面(3)包括由外触点组成的外接触表面(5),其布置在其下侧面(4)上。塑料外表面(3)覆盖有连续的金属层(7),直到下侧(4),其中,限定层(8)包括壳体(10)的塑料(10)的导电沉积物(9)。 )布置在塑料外表面(3)和连续金属层(7)之间。

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