EPOXY RESIN COMPOSITION, HARDENING PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL EPOXY RESIN, NOVEL POLYHYDROXY COMPOUND AND PROCESS FOR PRODUCING THE SAME

摘要

An epoxy resin composition that can be hardened rapidly, excelling in the flame retardance of a hardening product thereof obtainable even without the use of any halogen flame retardant, and that further excels in heat resistance. There are provided a hardening product thereof; a semiconductor sealing material comprising the epoxy resin composition; a novel epoxy resin and novel hydroxyl compound that can be used in the epoxy resin composition; and a process for producing the same.