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PROCESS FOR PRODUCING EXTREMELY FLAT MICROCRYSTALLINE DIAMOND THIN FILM BY LASER ABLATION METHOD
PROCESS FOR PRODUCING EXTREMELY FLAT MICROCRYSTALLINE DIAMOND THIN FILM BY LASER ABLATION METHOD
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机译:激光烧蚀法制备极扁平微晶金刚石薄膜的工艺
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摘要
Diamond thin films deposited by known PLD processes are composed of diamond crystal grains with a size of about 1 µm and have an irregular surface.;A process for producing an ultraflat nanocrystalline diamond thin film by laser ablation includes creating atomic hydrogen and a supersaturated state of carbon in a space between a target and a substrate in a hydrogen atmosphere inside a reaction chamber at a substrate temperature of 450°C to 650°C, a laser energy of 100 mJ or more, and a target-substrate distance of 15 to 25 mm to enable the growth of an ultraflat, single-phase nanocrystalline diamond thin film containing substantially no non-diamond component. The hydrogen atmosphere has a sufficient pressure to selectively completely etch off sp2 bond fractions (graphite fractions) deposited on the substrate with sp3 bond fractions remaining.
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