首页> 外国专利> MICROCOMPONENT COMPRISING A HERMETICALLY-SEALED CAVITY AND A PLUG, AND METHOD OF PRODUCING ONE SUCH MICROCOMPONENT

MICROCOMPONENT COMPRISING A HERMETICALLY-SEALED CAVITY AND A PLUG, AND METHOD OF PRODUCING ONE SUCH MICROCOMPONENT

机译:包括气密性腔和塞的微组分以及制备一种这样的微组分的方法

摘要

The invention relates to a microcomponent comprising a hermetically-sealed cavity and a plug and to a method of producing one such microcomponent. According to the invention, the microcavity (6) is defined by a cover (4) which is formed on a sacrificial layer and in which at least one hole (5) is provided for the removal of the sacrificial layer. Moreover, a plug (8) covers the hole (5) and part of the cover (4) along the periphery of the hole (5). The plug (8) is made from a material that can undergo creep deformation and can be a polymerised material, for example selected from photosensitive resins and polyimide, or glass, for example selected from phosphosilicate glasses. A sealing layer (9) is deposited on the plug (8) and the cover (4) such as to seal the microcavity (6) hermetically. According to the invention, the above-mentioned hole (5) has, for example, a dimension of less than 5 micrometers and is preferably disposed on the highest part of the microcavity (6). The plug (8) can have a thickness of between 2 and 6 micrometers.
机译:本发明涉及一种包括气密腔和塞子的微组件,并且涉及一种生产这种微组件的方法。根据本发明,微腔(6)由覆盖物(4)限定,该覆盖物形成在牺牲层上,并且其中设有至少一个孔(5)用于去除牺牲层。而且,塞子(8)沿着孔(5)的周边覆盖孔(5)和盖(4)的一部分。塞子(8)由可以经历蠕变变形的材料制成,并且可以是聚合材料,例如选自光敏树脂和聚酰亚胺,或者是玻璃,例如选自磷硅酸盐玻璃。密封层(9)沉积在塞子(8)和盖(4)上,以便气密密封微腔(6)。根据本发明,上述孔(5)的尺寸例如小于5微米,并且优选地设置在微腔(6)的最高部分上。塞子(8)的厚度可以在2至6微米之间。

著录项

  • 公开/公告号EP1708958A1

    专利类型

  • 公开/公告日2006-10-11

    原文格式PDF

  • 申请/专利权人 COMMISSARIAT A LENERGIE ATOMIQUE ( CEA);

    申请/专利号EP20040805700

  • 发明设计人 ROBERT PHILIPPE;

    申请日2004-12-14

  • 分类号B81B7/00;

  • 国家 EP

  • 入库时间 2022-08-21 21:26:32

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