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MICROCOMPONENT COMPRISING A HERMETICALLY-SEALED CAVITY AND A PLUG, AND METHOD OF PRODUCING ONE SUCH MICROCOMPONENT
MICROCOMPONENT COMPRISING A HERMETICALLY-SEALED CAVITY AND A PLUG, AND METHOD OF PRODUCING ONE SUCH MICROCOMPONENT
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机译:包括气密性腔和塞的微组分以及制备一种这样的微组分的方法
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摘要
The invention relates to a microcomponent comprising a hermetically-sealed cavity and a plug and to a method of producing one such microcomponent. According to the invention, the microcavity (6) is defined by a cover (4) which is formed on a sacrificial layer and in which at least one hole (5) is provided for the removal of the sacrificial layer. Moreover, a plug (8) covers the hole (5) and part of the cover (4) along the periphery of the hole (5). The plug (8) is made from a material that can undergo creep deformation and can be a polymerised material, for example selected from photosensitive resins and polyimide, or glass, for example selected from phosphosilicate glasses. A sealing layer (9) is deposited on the plug (8) and the cover (4) such as to seal the microcavity (6) hermetically. According to the invention, the above-mentioned hole (5) has, for example, a dimension of less than 5 micrometers and is preferably disposed on the highest part of the microcavity (6). The plug (8) can have a thickness of between 2 and 6 micrometers.
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