The present invention relates to a cooling apparatus of a computer central processing unit using a nano-fluid cooling, in more detail was previously mixed with a heat transfer coefficient of the coolant by injecting the nanoparticles of carbon or metal, as the cooling water for increasing the cooling efficiency of the liquid-cooled cooling system for cooling a liquid-cooled cooling system for cooling the heat generated by the computer central processing unit (CPU) the device to be more increased by 2 to 3-fold by increasing the cooling efficiency of the cooling device to achieve a reduction of the pump power required for the miniaturization and the cooling water circulation of the cooling unit to cool the heat generated increases with speed and integration of the CPU is to be provided. ; The prior art air-cooled cooling device is supplied to the heat spreader (heat sink) using an air fan provided in contact with the CPU for generating a heat sink for cooling the CPU a cooling device for the air is characterized, such as the air-to-air cooling system should be to increase the size of the heat sink and fan in order to sufficiently cool the CPU, which increases the heat capacity, and a problem that the need to increase the number of revolutions of the fan, and , a conventional liquid cooling apparatus of the technology of the CPU, but also a method of increasing the flow velocity of the cooling fluid flowing in the cooling chain, and also there is a problem with such a water-cooled cooling device for the pump capacity to be increased. ; This invention The microprocessor of the cooling device using cooling water in accordance with a nano-fluid which is the cooling water flows through the pipe was closed to absorb heat generated by the CPU, including cooling of nanoparticles to the cooling device having a configuration in which discharge to the outside from the heat sink It seeks to promote more effective.
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