APPARATUS FOR TESTING MICROSTRUCTURE, METHOD FOR TESTING MICROSTRUCTURE, AND PROGRAM FOR TESTING MICROSTRUCTURE

摘要

Test sound wave is outputted from a speaker (2). A movable part of a three-axis acceleration sensor, which is a micro structure of a chip to be tested TP, moves due to the arrival of the test sound wave which is compression wave outputted from the speaker (2), that is, due to air vibrations. A change in the resistance value that changes in accordance with this movement is measured on the basis of an output voltage that is provided via probe needles (4). A control part (20) determines the property of the three-axis acceleration sensor on the basis of the measured data.