CLEANING CHEMICAL AND CLEANING METHOD FOR REMOVING ORGANIC MATERIAL IN CHEMICAL MECHANICAL POLISHING PROCESS

摘要

A chemical mechanical polishing (CMP) and clean method are provided, using detergent use in organic removal in this step. According to the present invention, the chemical mechanical polishing of wafer surface is added to pure water and pure water is used to clean washing water and provides for cleaning with chemo-mechanical polishing agent containing a hydrophilic solvent (hydrophilic solvent) mobile organic remains in wafer surface.