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METHOD OF FORMING PHOTORESIST PATTERNS HAVING FINE PITCH USING DOUBLE PATTERNING TECHNIQUE
METHOD OF FORMING PHOTORESIST PATTERNS HAVING FINE PITCH USING DOUBLE PATTERNING TECHNIQUE
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机译:利用双图案技术形成具有精细间距的光致抗蚀剂图案的方法
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摘要
A method of forming a photoresist pattern comprises providing a semiconductor substrate on which a layer to be etched is formed. The method further comprises forming a first photoresist pattern on the layer to be etched, processing the first photoresist pattern with hydrogen bromide (HBr) plasma, and forming a second photoresist pattern on the semiconductor substrate between the first photoresist patterns
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