首页> 外国专利> NEW OLIGOMERIC AMIC ACID AND POLYIMIDE NANOCOMPOSITES CONTAINING ORGANOPHILIC LAYERED SILICATES MODIFIED THEREFROM

NEW OLIGOMERIC AMIC ACID AND POLYIMIDE NANOCOMPOSITES CONTAINING ORGANOPHILIC LAYERED SILICATES MODIFIED THEREFROM

机译:包含有机硅层状硅酸盐的新型低聚阿米酸和聚酰亚胺纳米复合材料的改性

摘要

The present invention relates to novel in the amic acid oligomer with as it relates to a polyimide nanocomposite material by containing a modified organophilic layered silicate is used, more particularly, to a flexible side chain is introduced into a diamine derivative with an aliphatic or aromatic tetracarboxylic acid dianhydride this polymerized the amine group introduced at the terminal novel amic acid oligomer, and the amic acid the organophilic layered modified with a cation exchange reaction with oligomeric silicates with, and nano the organophilic layered silicate and the polyimide-based resin or precursor thereof the composite is stable to heat, such as thermal properties and coefficient of thermal expansion to an improved polyimide nanocomposites. ; The amine group was introduced at the terminal amic acid oligomer, a organophilic layered silicate, polyimide nanocomposites
机译:本发明涉及酰胺酸低聚物中的新型,因为它涉及通过包含改性的亲有机层状硅酸盐而使用的聚酰亚胺纳米复合材料,更特别地,涉及将柔性侧链引入具有脂肪族或芳香族四羧酸的二胺衍生物中酸二酐,它聚合了在末端新型酰胺酸低聚物上引入的胺基,以及通过阳离子交换反应与低聚硅酸盐与以下分子进行了阳离子交换反应改性的亲有机层的酰胺酸,以及纳米级亲有机层的硅酸盐和聚酰亚胺基树脂或其前体。复合材料对热稳定,例如热性能和热膨胀系数,以改进聚酰亚胺纳米复合材料。 ;在末端酰胺酸低聚物,亲有机层状硅酸盐,聚酰亚胺纳米复合材料上引入胺基

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