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Buffered memory module package and module-stacked package comprising the module package
Buffered memory module package and module-stacked package comprising the module package
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机译:缓冲存储器模块封装和包括该模块封装的模块堆叠式封装
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摘要
A method and apparatus of fabricating a semiconductor device are disclosed. The semiconductor device may include a buffer chip package having a buffer chip mounted on a buffer chip substrate and at least one memory package mounted on the buffer chip substrate, wherein the at least one memory package may include a plurality of memory chips. Further, the buffer chip package may have a plurality of external connection terminals.
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