multi-layer microstrip transmission line upon dielectric post using surface MEMS technique and method thereof

摘要

The present invention produce a dielectric pillars on the semiconductor substrate surface using surface MEMS technology and signal above the pillars relates to the form of a low-loss microstrip transmission line and placed manufacturing method, a plurality of first dielectric pillars to reduce the dielectric losses in the dielectric between the implementation oxidized porous silicon substrate top surface to the transmission line and the transmission line ground plane and making a comparison with a conventional low-loss transmission line of a millimeter wave integrated circuit using the first, by making the first signal line in the dielectric and a second dielectric pillar upper pole and a second signal on the first signal line, MEMS technology process is relatively simple, the transmission line and reduces the dielectric loss by the dielectric loss and the substrate occurring in the dielectric between the ground plane of a conventional integrated circuit element and the low-loss transmission line of a millimeter wave integrated circuit compatible with one another, and a manufacturing method thereof to be about.