The present invention relates to an ultraviolet irradiating apparatus for irradiating ultraviolet rays to easily separate the semiconductor chips or packages from a semiconductor wafer, or a strip attached to the support frame, it is installed in the UV housing and the UV housing, the wafer and ultraviolet ray lamps for irradiating with ultraviolet rays, is installed in correspondence with the UV lamp to the inside of the ultraviolet light housing, a screen to limit the irradiation range of the ultraviolet rays emitted from the UV lamp to be irradiated only to a semiconductor chip attachment sites available on the wafer It is configured to include a mounting plate is formed, to ensure that the scrap of the adhesive tape, the adhesive strength is still kept attached, and the separation step of a semiconductor chip or a package to be smoothly performed. ; A semiconductor chip, wafer, UV irradiation
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