首页>
外国专利>
Via-In-Pad With Off-Center Geometry and Methods of Manufacture
Via-In-Pad With Off-Center Geometry and Methods of Manufacture
展开▼
机译:具有偏心几何形状的填充孔和制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit are coupled to printed circuit board (PCB) bonding pads that include vias. According to one embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder balls during a solder reflow operation by minimizing the effect of solder ball ballooning resulting from outgassing of a thermally expansive substance, such as a volatile organic compound (VOC) from the via channels. A substrate and an electronic system are also described.
展开▼