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A structure of raw material for manufacture of one or both sides exposure type-Flexible Printed Circuit BoardFPCB and exfoliation-adhesion method of protective film therefore
A structure of raw material for manufacture of one or both sides exposure type-Flexible Printed Circuit BoardFPCB and exfoliation-adhesion method of protective film therefore
The invention detachment of single-sided or double-sided surface-type structure and a protective film of raw materials for manufacturing flexible printed circuit board and relates to a mounting method, the object is continuously sent to the release only the area where the protective film is attached to a printed circuit laminated on the upper layer of the raw material when manufacturing the flexible printed circuit board in the form of a roll form, a printed circuit and maintaining the smoothness of the raw material roll throughout the process, the printed circuit is to be prepared in the form of a flexible printed circuit board as well as to minimize the fraction defective plates to be conducted by a post-process to easily attach the protective film on the finished raw materials even when the method is to provide the peel and attach securely by a portion of a jig for holding the structure of the raw materials for manufacture of the flexible printed circuit board to minimize any effects of the jig gripping and protective film and is arranged so that the polyimide or other base film and made of a resin, and a copper foil is attached is laminated on the base film, and the photosensitive resin is laminated on the copper foil to be attached; And the photosensitive resinous protective film is laminated to the configured cross-section to be attached or exposed base film made of polyimide or other resin, and a plurality of copper foil respectively adhered to upper and lower surfaces of the laminated base film, on the respective copper foil and a plurality of photosensitive resin which are laminated attached, in the manufacture of raw materials of the respective two-sided surface-type photosensitive resinous laminate consisting of a flexible printed circuit board is attached to a plurality of protective films, wherein the raw material is inward from each side end portion of the protective film 20 to 30 interval binary characterized in that the cutting line is formed along the longitudinal direction to the position.
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