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Cooling design for PCB applied to air conditioner

机译:应用于空调的PCB的冷却设计

摘要

PURPOSE: A radiating structure of a PCB(Printed Circuit Board) for an air conditioner is provided to maximize a radiating effect and reduce a size of an air conditioner. CONSTITUTION: A heat sink(60) is mounted in front of a heat exchanger(50). The heat exchanger(50) includes refrigerant pipes(51) and fins(52) through which the pipes(51) pass. The distance between the fins(52) which are disposed in right rear of the heat sink(60) are larger than that between the fins which are not aligned with the heat sink(60), thereby forming a large-spaced portion(50a). The air passing through the large-spaced portion(50a) flows faster than the air passing through other portion of the heat exchanger(50). Therefore, the quantity of the air flowing toward the heat sink(60) is increased. Also, since the temperature of the air passing through the large-spaced portion(50a) of the heat exchanger(50) and flowing toward the heat sink(60) is relatively low, the radiating efficiency of the heat sink(60) is enhanced.
机译:目的:提供一种用于空调的PCB(印刷电路板)的散热结构,以最大化散热效果并减小空调的尺寸。组成:散热器(60)安装在热交换器(50)的前面。热交换器50包括制冷剂管51和使管51通过的翅片52。设置在散热器(60)的右后方的翅片(52)之间的距离大于不与散热器(60)对准的翅片(52)之间的距离,从而形成大间隔的部分(50a)。 。穿过大间隔部分(50a)的空气比穿过热交换器(50)的其他部分的空气流动得更快。因此,流向散热器60的空气量增加。另外,由于穿过热交换器50的大间隔部分50a并流向散热器60的空气的温度较低,因此散热器60的散热效率提高。 。

著录项

  • 公开/公告号KR100624739B1

    专利类型

  • 公开/公告日2006-09-18

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR19990030322

  • 发明设计人 남현식;

    申请日1999-07-26

  • 分类号H05K7/20;

  • 国家 KR

  • 入库时间 2022-08-21 21:23:01

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