Selective coating method used in the semiconductor industry comprises preparing a substrate, covering predetermined surface regions of a surface with a mask, inserting a coating controlling agent and catalytically depositing a thin layer

摘要

Selective coating method comprises preparing a substrate (101), covering predetermined surface regions of a substrate surface (103) with a mask, inserting a coating controlling agent (104a,104b) into the substrate in the regions of a non-covered surface of the substrate and catalytically depositing a thin layer (105) on the surface of the substrate. An independent claim is also included for: a thin layer system produced.