Thermoelectric heat dissipation device fabricating method, involves adhering thermoelectric semiconductive unit to be sandwiched between base plate and heat sink so that P-N posts are electrically connected with conductive lines

摘要

The method involves providing a base plate (1) with a surface patterned with a set of conductive lines. A heat sink (3) having a patterned surface is provided with another set of conductive lines. A thermoelectric semiconductive unit is adhered to be sandwiched between the base plate and the heat sink so that a set of P-N posts of the semiconductive unit are electrically connected with the conductive lines respectively. An independent claim is also included for a thermoelectric heat dissipation device comprising a thermoelectric semicondutive unit.