Procedure for simultaneous cutting of multiple cylindrical semiconductor discs involves arranging workpiece in wire gate of wire saw perpendicular to longitudinal axis of workpiece with relative motion at predetermined speeds

摘要

Procedure for simultaneous cutting of multiple brittle core discs involves running wire saw (3) at predetermined speed in the range of 0.3 to 1.2 mm per min until a cut with depth within range of 0.1 to 2 mm is formed. The speed is increased to be in the range of 2 to 100 mm per minute for a duration of 2 to 120 seconds and thereafter speed is reduced to be in the range of 0.3 to 1.2 mm per minute.