首页> 外国专利> Base plate pre-arrangement method, involves passing base plate through drill hole having smaller diameter, where deep floor plastering with larger diameter takes place under base plate

Base plate pre-arrangement method, involves passing base plate through drill hole having smaller diameter, where deep floor plastering with larger diameter takes place under base plate

机译:底板的预先布置方法,包括使底板穿过直径较小的钻孔,在底板下方进行直径较大的深层地面抹灰

摘要

The method involves passing a base plate through a drill hole having smaller diameter. A deep floor plastering with larger diameter takes place under the base plate. The process steps are implemented together with a drill pipe attached bore and mixed tool without pulling a drill pipe. The deep floor plastering takes place with the diameter that is variable by the height. An independent claim is also included for a bore and mixed tool.
机译:该方法包括使基板穿过具有较小直径的钻孔。在底板下方进行直径较大的深层地面抹灰。无需拉动钻杆即可与附有钻杆的钻孔和混合工具一起实施工艺步骤。深层地面抹灰的直径随高度而变化。钻孔和混合工具也包含独立索赔。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号