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A galvanic method for the filling of through holes with metals, in particular of printed circuit boards with copper

机译：一种用金属填充通孔的电镀方法，尤其是用铜填充印刷电路板

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摘要

The present invention relates to a galvanic method for the filling of through holes with metals. The process is particularly suitable for the filling of through holes of printed circuit boards with copper.

机译：用于用金属填充通孔的电镀方法技术领域本发明涉及一种用金属填充通孔的电镀方法。该方法特别适合于用铜填充印刷电路板的通孔。

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公开/公告号DE102004045451A1

专利类型
公开/公告日2006-03-30

原文格式PDF
申请/专利权人 ATOTECH DEUTSCHLAND GMBH 10553 BERLIN DE;
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申请/专利号DE20041045451
发明设计人 PLIET THOMAS 10435 BERLIN DE;KIM SOUNGSOO 12105 BERLIN DE;FUJIWARA TOSHIYA 10715 BERLIN DE;YOUKHANIS MARKUS 10437 BERLIN DE;ROELFS BERND DR. 14050 BERLIN DE;REENTS BERT 10407 BERLIN DE;WENZEL RENÉ 13597 BERLIN DE;
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申请日2004-09-20
分类号H05K3/42;H05K3/46;C25D5/18;
国家 DE
入库时间 2022-08-21 21:20:45

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