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Micromechanical sensor unit for vehicle tire, has opening extending up to cavern, seismic mass e.g. solder bump, provided underneath or in diaphragm, and piezo resistance in diaphragm for measuring deflection of diaphragm
Micromechanical sensor unit for vehicle tire, has opening extending up to cavern, seismic mass e.g. solder bump, provided underneath or in diaphragm, and piezo resistance in diaphragm for measuring deflection of diaphragm
The unit has a substrate (5) and a diaphragm (10) is provided in the substrate. A cavern (12) is formed underneath the sensor unit and an opening is provided in the diaphragm, where the opening extends up to the cavern. A seismic mass e.g. solder bump (22), is provided underneath or in the diaphragm. A piezo resistance (14) is provided in the diaphragm for measuring deflection of the diaphragm. An independent claim is also included for a method of manufacturing a micro mechanical sensor unit.
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