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Micromechanical component, has diaphragm with oxidized pores layer, which is attached at n-doped ring-shaped frame area, and consisting of macro porous silicon with middle pore diameter in certain range
Micromechanical component, has diaphragm with oxidized pores layer, which is attached at n-doped ring-shaped frame area, and consisting of macro porous silicon with middle pore diameter in certain range
The component has a hollow space (11) provided in a p-doped silicon semiconductor substrate (1). A diaphragm is provided on a surface of the substrate and closes the hollow space. The diaphragm has an oxidized pore layer, which is attached at an n-doped ring-shaped frame area (2). The diaphragm consists of macro porous silicon with a middle pore diameter in a range of 50 nanometers to 3 picometers. An independent claim is also included for a method of manufacturing a micromechanical component.
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