Imperfect edge beads detecting method for disk shaped object e.g. wafer, involves specifying markings in boundary region of reference object, where inspection of object is limited to position of markings specified in object

摘要

The method involves taking up a boundary region of a disk shaped reference object e.g. wafer, where markings are specified in the boundary region of the reference object. An image of the boundary region of the object is taken by a camera that is arranged on a surface of the reference object. An inspection of the disk shaped object is limited to positions of the markings specified in the reference object.