首页> 外国专利> RFID chip and strip substrate contact surfaces electrical and mechanical connection establishing method for transponder, involves hooking chip surfaces having hooks/lugs with substrate surfaces having hooks/lugs with size in nanometer range

RFID chip and strip substrate contact surfaces electrical and mechanical connection establishing method for transponder, involves hooking chip surfaces having hooks/lugs with substrate surfaces having hooks/lugs with size in nanometer range

机译:Rfid芯片与条状基板接触面的应答器的机电连接建立方法,涉及将具有钩子/凸耳的芯片表面钩住,而具有钩子/凸耳的衬底表面具有纳米范围的尺寸。

摘要

The method involves hooking contact surfaces (11, 12) of a chip, having a set of wire-shaped hooks/lugs (13) on their surfaces, with contact surfaces (19, 20) of a strip substrate, having a set of hooks/ lugs (16) on their surfaces, by applying pressure on the surfaces (19, 20). An RFID antenna is arranged on the substrate. Electrically conducting wires are used as a material for the hooks/lugs with a size in a nanometer range.
机译:该方法包括钩住芯片的接触表面(11、12),芯片的接触表面在其表面上具有一组线形钩/凸耳(13),而带状基板的接触表面(19、20)具有一组钩。通过在表面(19、20)上施加压力,将凸耳(16)固定在其表面上。 RFID天线布置在基板上。导电线被用作钩/突耳的材料,其尺寸在纳米范围内。

著录项

  • 公开/公告号DE102005016930A1

    专利类型

  • 公开/公告日2006-09-21

    原文格式PDF

  • 申请/专利权人 MUEHLBAUER AG;

    申请/专利号DE20051016930

  • 发明设计人 BROD VOLKER;

    申请日2005-04-13

  • 分类号H01L21/60;H01L23/498;H01L49/00;H04B1/59;H01R43/20;H01R12/36;

  • 国家 DE

  • 入库时间 2022-08-21 21:20:19

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