Cooling device for CPU of motherboard, has heat dissipating conduit running transversely between cooling substrate and ribbed cooling assembly with high difference, so that dissipating region lies more highly than absorption region

摘要

The device has a cooling substrate (3) arranged at a side of a ribbed cooling assembly (1), and a heat dissipating conduit (2) with absorption (21) and dissipating (22) regions. The region (22) is arranged on the assembly, and the region (21) is mounted on the substrate. The conduit runs transversely between the substrate and the assembly with a high difference, so that the region (22) lies more highly than the region (21).